Shenzhen Kuayue Electronic Co., Ltd.

High thermal conductivity heatsink thermal pad

High thermal conductivity heatsink thermal pad
Product Detailed

High thermal conductivity pad
-High thermally conductivity
-ROHS & UL listed
-Industry direct price
-Heatsink thermal pad

High thermal conductivity heatsink thermal pad is designed with very good high thermal conductivity and coherent winding, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.

 

Features & benefits:

1.High compressibility, soft and flexible, designed for applications in low-stress application environment

2.Nice thermal conductivity

3.Electrical insulation

4.Meet with the environmental requirements of ROHS and UL

5.Natural stickiness

 

Typical applications:

1.Laptop

2.Communication hardware equipment

3.High-speed hard disk drive equipment

4.Automobile engine control mould

5.Micro processor, memory chip and graphics processor

6.Mobile equipment

 

Physical properties:

Test item

Test method

Unit

Test value of HCH series

HCH600 value

HCH500 value

Color

Visual

 

Blue/Laterite 

Blue/Yellow

Thickness

ASTM D374

Mm

0.25 to 5.0

0.25 to 5.0

Specific Gravity

ASTM D792

g/cm3

2.85

2.7

Hardness

ASTM D2240

Shore C

30

30

Tensile strength

ASTM D412

kg/cm2

55

55

Continuous Use Temp

EN 344

°C

-40 to 220

-40 to 220

Volume Resistivity

ASTM D257

Ω-cm

3.1*1011

3.1*1011

Breakdown voltage

ASTM D149

KV/mm

>5.0

>5.0

Flame Rating

UL-94

 

94-V0

94-V0

Conductivity

ASTM D5470

w/m-k

              6.0

5.0

 

Configurations available: 200mm*400mm, 300mm*400mm;  specific size could be provided according to your requirements.

 

Packaging:

-Carton box & Plastic bags
-430mm*230mm*120mm for 200mm*400mm size
-320mm*320mm*120mm for 300mm*300mm size

 

 



Copyright Notice @ 2008-2022 B2BAGE Limited and/or its subsidiaries and licensors. All rights reserved.